MediaTek has introduced two new mid-range chipsets, the Dimensity 7300 and Dimensity 7300X, heralding advancements in performance and imaging capabilities. Fabricated on a 4nm process node, these chips promise a significant reduction of 25% in power consumption on their performance cores compared to the Dimensity 7050. In this article, we shall discuss more on MediaTek Launches Dimensity 7300 Series with its features.
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MediaTek Launches Dimensity 7300 Series:
MediaTek recently announced the launch of two new mid-range chipsets, the Dimensity 7300 and Dimensity 7300X. These chips are designed to offer better performance and improved camera capabilities compared to their predecessor, the Dimensity 7050. One key improvement is the reduction in power consumption by 25% on the performance cores, thanks to the use of a more advanced 4nm process node. This means that devices powered by these new chipsets can potentially offer longer battery life and better overall efficiency.
Enhanced Performance with Advanced Core Configuration:
Unlike the Dimensity 7050, which had a (2+6) core cluster configuration, the Dimensity 7300 series features 4 Cortex-A78 cores clocked at 2.5GHz paired with 4 Cortex-A55 cores clocked at 2.0GHz. These cores are the same as those used in the Dimensity 7050, but MediaTek claims that there are performance and power efficiency improvements with the new chipsets. This means that users can expect smoother performance and better energy efficiency when using devices powered by these chipsets.
Improved Gaming Experience and Connectivity Features:
In terms of graphics performance, the Dimensity 7300 series comes equipped with the latest Arm Mali-G615 GPU, along with a suite of MediaTek HyperEngine optimizations aimed at improving the gaming experience. According to MediaTek, both chipsets offer a 20% higher frame rate and 20% less power consumption compared to their competitors, making them ideal for gaming enthusiasts. Additionally, the series offers features like smart resource optimization, network optimization for games, and support for Bluetooth LE with Dual-Link True Wireless Stereo Audio, enhancing the overall user experience.
Dual Display Support and Imaging Enhancements:
One key difference between the two chipsets is that the Dimensity 7300X supports dual displays, making it suitable for use in foldable devices. This means that devices powered by the Dimensity 7300X can potentially offer a more immersive and versatile user experience by allowing users to multitask more effectively across two screens.
In terms of imaging capabilities, the Dimensity 7300 series introduces the new MediaTek Imagiq 950, which features a premium-grade 12-bit HDR-ISP. This allows mid-range phones powered by these chipsets to support a 200MP main camera, as well as offering enhanced hardware engines for precise noise reduction, face detection, and video HDR. MediaTek claims that live focus photo performance and photo remastering are now 1.3 times and 1.5 times faster respectively compared to the Dimensity 7050, allowing OEMs to provide better camera systems in their devices.
Advanced AI Performance:
The Dimensity 7300 series also boasts the MediaTek APU 655, which offers a 2 times improvement in AI performance compared to the Dimensity 7050. This means that devices powered by these chipsets can potentially offer more advanced AI features and capabilities, such as improved voice recognition, smarter camera algorithms, and better overall performance in AI-driven tasks.
MediaTek Dimensity 7300 Series Specification Table:
| Feature | Dimensity 7300 | Dimensity 7300X |
|---|---|---|
| Process Node | 4nm | 4nm |
| CPU Cores | 4 x Cortex-A78 @ 2.5GHz | 4 x Cortex-A78 @ 2.5GHz |
| 4 x Cortex-A55 @ 2.0GHz | 4 x Cortex-A55 @ 2.0GHz | |
| GPU | Arm Mali-G615 | Arm Mali-G615 |
| Imaging Technology | MediaTek Imagiq 950 | MediaTek Imagiq 950 |
| Camera Support | Up to 200MP | Up to 200MP |
| AI Performance | MediaTek APU 655 | MediaTek APU 655 |
| Dual Display Support | No | Yes |
| Connectivity | Bluetooth LE, Dual-Link True Wireless Stereo Audio, NFC, eSIM | Bluetooth LE, Dual-Link True Wireless Stereo Audio, NFC, eSIM |
| Gaming Optimization | MediaTek HyperEngine | MediaTek HyperEngine |
| Power Consumption | 25% lower than Dimensity 7050 | 25% lower than Dimensity 7050 |
Conclusion:
In conclusion, the MediaTek Dimensity 7300 and Dimensity 7300X chipsets bring significant improvements in performance, imaging capabilities, and AI performance to the mid-range smartphone market. With their advanced features and competitive pricing, these chipsets are expected to power a new generation of mid-range smartphones that offer better performance, enhanced camera capabilities, and improved overall user experiences.
