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Friday, December 27, 2024
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HomeTech NewsMediaTek Unveils Helio G100 Chipset with Enhanced Camera Support and Improved Connectivity

MediaTek Unveils Helio G100 Chipset with Enhanced Camera Support and Improved Connectivity

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MediaTek has officially launched its latest Helio G100 chipset, which debuts in the Tecno Camon 30S Pro. Building on the foundation of the Helio G99, the new G100 brings significant improvements, particularly in camera capabilities and connectivity features, making it an attractive option for mid-range smartphones focused on delivering high-resolution photography and reliable network performance. This article will discuss MediaTek Helio G100 SoC features in further detail.

MediaTek Helio G100 SoC features:

The MediaTek Helio G100 chipset features an octa-core CPU with two 2.2 GHz Cortex-A76 cores and six 2.0 GHz Cortex-A55 cores. It supports LPDDR4X RAM, UFS 2.2 storage, and a maximum display resolution of 2,520 x 1,080 pixels.

Further, the chipset can handle 200 MP main cameras, 16 + 16 MP dual camera setups, and 32 MP video capture at 30 fps. Additionally, it includes the “Elevator Mode” for faster reconnection after network loss, dual 4G SIM support, VoLTE, and ViLTE capabilities.

MediaTek Helio G100 SoC features

MediaTek Helio G100 SoC Specifications:

SpecificationDetails
CPUOcta-core: 2x Cortex-A76 @ 2.2 GHz + 6x Cortex-A55 @ 2.0 GHz
RAMLPDDR4X
StorageUFS 2.2
Display Support2,520 x 1,080 pixels
Camera Support– Up to 200 MP main camera
– 16 + 16 MP dual camera
– 32 MP video capture @ 30 fps
Special Feature“Elevator Mode” for quick reconnection
Connectivity– Dual 4G SIM
– VoLTE
– ViLTE

Conclusion:

In conclusion, the MediaTek Helio G100 chipset builds on its predecessor with key improvements in camera capabilities and connectivity features. It maintains a balance between performance and cost, making it a viable option for mid-range smartphones focused on delivering enhanced photography and reliable network connectivity.

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