Xiaomi has officially announced that its new foldable phones, the Mix Fold 4 and Mix Flip, along with the Redmi K70 Ultra, will debut this month in China. The launch event, anticipated to take place later in July, will showcase these advanced devices equipped with cutting-edge features, including the Dimensity 9300 Plus chipset for the Redmi K70 Ultra and the Snapdragon 8 Gen 3 chipset for the Mix Fold 4 and Mix Flip.
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Xiaomi Mix Fold 4 launch:
Xiaomi’s new foldable phones, the Mix Fold 4 and Mix Flip, are set to launch this month alongside the Redmi K70 Ultra. This news comes from a recent post on Weibo, where Xiaomi confirmed the devices would be unveiled at the same event later in July.
New Smart Factory and Production:
In an exciting development, Xiaomi revealed that their new smart factory has started full-scale production. This factory uses advanced automation and digitalization, achieving 100% automated critical processes through self-developed manufacturing equipment. The factory also relies on “full-chain industrial big data” for complete digitalization of production. This high-tech facility will produce the upcoming Mix Fold 4 and Mix Flip foldable phones.
Mix Fold 4 and Mix Flip Specifications:
Mix Flip:
The Mix Flip will be Xiaomi’s first flip-style foldable phone and will come in four options: 12GB+256GB, 12GB+512GB, 16GB+512GB, and 16GB+1TB. It will have a 4-inch outer display and a dual camera setup with a 50-megapixel main camera and a 60-megapixel telephoto lens with optical image stabilization (OIS). The device will also support 67W fast charging.
Mix Fold 4:
The Mix Fold 4 will boast a quad-camera setup: a 50-megapixel main camera with OIS, a 12-megapixel ultra-wide lens, a 60-megapixel telephoto camera with 2x optical zoom, and a 10-megapixel periscope telephoto camera with 5x optical zoom. The battery will be over 5,000mAh and support both 67W fast charging and wireless charging.
Redmi K70 Ultra: High-Performance Expected
The Redmi K70 Ultra, another highlight of the event, will be powered by the Dimensity 9300 Plus chipset. While specific details are still under wraps, its high-performance chipset is expected to deliver impressive speed and efficiency.
Conclusion
As the event approaches, fans can look forward to seeing Xiaomi’s latest innovations and advancements in foldable phone technology. Stay tuned for more updates and detailed features once these exciting new devices are officially unveiled. Learn more about the prices of all Xiaomi devices here.
